Predictive Modeling Enables Quantifying Burn-in-Testing (BIT)
in Electronic Manufacturing
Abstract
Predictive modeling enables shedding useful light on what and how should be tested, if at all. A probabilistic predictive model using the recently suggested multi-parametric Boltzmann-Arrhenius-Zhurkov constitutive equationis employed to establish the BIT’s adequate duration and stressor(s) level, if this kind of failure-oriented-accelerated-testing (FOAT) is found to be necessary. The theoretical findings are illustrated by calculated data. It is concluded that the PPM of the addressed type of FOAT should always precede the actual BIT, which is, in effect, a typical FOAT, although conducted at the manufacturing, not at the design stage. It is concluded also that analytical ("mathematical")modeling should always complement computer simulations, if any: these two major modeling tools are based on different assumptions and use different calculation techniques, and if the output data obtained using these tools are in agreement, then there is a good reason to believe that these data are accurate and trustworthy. Future work should address the experimental validation and possible extension of the obtained results and recommendations.
Short Biography
Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and is CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA. Was born in Odessa, Ukraine. Naturalized US citizen (since1985). He is Foreign Full Member of the National Academy of Engineering, Ukraine (he was born in that country) Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS) Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE) and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 500+ publications (patents, technical papers, book chapters, books), presented numerous plenary, keynote, invited and contributed talks worldwide, and received many professional awards, including 1996 Bell Labs. Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. His most recent awards are 2019 IEEE Electronic Packaging Society (EPS) Field award (for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems), 2019 IMAPS Lifetime Achievement award (for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology) and 2022 IEEE SCV Section Outstanding Engineer award (for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials, devices and systems, and the role of the human factor).
