Shaping the Future of Innovative Semiconductor Technologies
Abstract
Recently, we have witnessed that unprecedented revolution of AI, exemplified by advancements such as ChatGPT4.0, leading to steeper acceleration in the growth trajectory of semiconductor industry and opening greater opportunities [1]. In order to satisfy the semiconductor market’s requirements, it is indispensable to surpass the past technology scaling trend for high bandwidth and large capacity of memory together with excellent power efficiency of computing in data center and mobile devices. However, we will face many physical and electrical challenges from extremely small dimensions of silicon devices, complex and expensive fabrication processes. In order to overcome these limitations cost-effectively, it is essential to create a synergy effect between silicon device and advanced package technologies that is, adopting innovative structures, novel materials and advanced processes together with advanced 2.5D chiplet or 3D integration. In this presentation, we will review the history of technology evolution, and discuss promising innovative technology candidates of DRAM, Flash, Logic and Package for next decades.
Short Biography
Dr. Kinam Kim has greatly contributed to the semiconductor industry on many fronts for more than 40 years since he joined Samsung in 1981. His contributions, leadership, and strategic vision have paved the way for Samsung's role as a semiconductor technology innovator in the industry.
Dr. Kinam Kim currently serves as Senior Advisor of Samsung Electronics. Until 2023, Dr. Kim was Chairman, CEO of Samsung Electronics, and Head of Samsung Electronics Device Solutions Division, overseeing global operations of all semiconductor related business.
Under Dr. Kim's leadership as CEO, Samsung's memory business has been fortified on solid foundations not only with world-leading technological capabilities to include first-to-market products in DRAM, High Bandwidth Memory (HBM), NAND and Solid State Drives (SSD), but also with global production capabilities to include Xi'an NAND fabs in China which have operated since 2014. Samsung's System LSI business has also brought innovations for products such as mobile application processors (AP), modem chipsets, CMOS image sensors, and display driver ICs for a wide range of end markets. Samsung Foundry, established as an independent business unit in 2017, has been an innovator in advanced logic processes and specialty technologies, with industry's first breakthroughs. Notable examples are high-k metal gate (HKMG) transistor
(32 nm), FinFET process technologies (14 nm, 10 nm, and 8nm), and EUV (Extreme Ultra Violet)-based process technologies (7 nm and below), as well as the world's first 3nm process technology on Gate-All-Around (GAA) transistor architecture.
Previously, he served in numerous leadership positions including the President and CEO of Samsung Display Co. and Samsung Advanced Institute of Technology where he spearheaded the research and development of frontier technologies that have significantly impacted not only the semiconductor industry but also adjacent industries, such as quantum dots, graphene, carbon nanotubes and advanced materials for next generation display technologies.
As a scholar and engineer, Dr. Kim has published more than 480 papers in world class journals, including in Nature and Science, and holds more than 360 patents. His contributions (RCAT DRAM, 3D V-NAND, MBCFET and HBM) to the semiconductor industry have been recognized, and some of the latest recognitions include "IMEC Lifetime Achievement Award" in 2017 and "Flash Memory Summit Lifetime Achievement Award" in 2016. In Korea, Dr. Kim was recognized as the National technology leader in science by receiving the highest honor and recognition by the President of Korea, "The Korea Science & Technology Award" in 2019. Dr. Kim is an IEEE Fellow, an International Member of the National Academy of Engineering (US NAE), and an International Fellow of the Royal Swedish Academy of Engineering Sciences (IVA), and the Royal Academy of Engineering (RAEng) and an International Member of the Chinese Academy of Engineering (CAE). Since 2023, he has served as the President of the National Academy of Engineering of Korea.
Dr. Kim received his B.S. in Electrical Engineering from Seoul National University in 1981, M.S. in Electrical Engineering from Korea Advanced Institute of Science and Technology (KAIST) in 1983, and his Ph.D. in Electrical Engineering from University of California Los Angeles (UCLA) in 1994.
