Challenges and Opportunities in Future Innovative Semiconductor Technologies for Next Decades
Abstract
Semiconductor market has been continuously growing for the past 50 years and is projected to accelerate its previous growth trajectory thanks to the recent explosion of generative AI, IoT, 5G, automotive and so on. In order to satisfy the requirements for memory, storage, and computation, however, we will face and overcome many challenges from an extremely small physical dimension of silicon devices, complex and expensive fabrication processes. Since these enormous opportunities are strongly dependent on technological advancements, the key is relentless technical innovations in materials, processes, structures and equipment toward improving PPA (power-performance-area) in a cost-effective way through collaborative and shared efforts among academia, industry and government. To this aim, this paper will review the history of technology evolution, and discuss technical directions together with promising innovative candidates of DRAM, Flash, Logic and Package for next decades.
Short Biography
Daewon Ha received Ph.D. degree in electrical engineering and computer science from the University of California, Berkeley, in 2004.
In 1995, he joined Samsung Electronics, Co., Ltd., Korea where he was involved in the development of world-first fully working 1 Gb DRAM, and Logic 10 nm and 5 nm technology nodes using FinFET. Currently, he is now in charge of advanced device research lab including DRAM, Flash, Logic and emerging devices as a head of lab in semiconductor R&D center.
He has published more than 70 technical papers and holds more than 80 issued and pending patents on memory technology.
Dr. Ha served as an editor of IEEE EDL from 2012 to 2020, a sub-committee member of the International Electron Devices Meeting (IEDM) from 2010 to 2012, and the International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) from 2008 to 2010.
